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Co-authors
- Suk Ho ChungKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- HAMDAN AhmadUniversité de MontréalVerified email at umontreal.ca
- Sang Hee WonDepartment of Mechanical Engineering, University of South CarolinaVerified email at mailbox.sc.edu
- Ramses SnoeckxScientist & Project Leader, Empa, Swiss Federal Laboratories for Materials Science and TechnologyVerified email at empa.ch
- Xuming Zhang (旭明)ZJ; miraclezhang918@163.comVerified email at zstu.edu.cn
- Dae Geun ParkKorea Institute of Industrial TechnologyVerified email at kitech.re.kr
- Yuan XiongBeihang UniversityVerified email at buaa.edu.cn
- Manh-Vu TranMonash University Malaysia, The University of SydneyVerified email at monash.edu
- Bok Jik LeeAssociate Professor, Seoul National UniversityVerified email at snu.ac.kr
- Weizong WangAdvanced Space Propulsion and Energy Laboratory (ASPEL), School of Astronautics, Beihang UniversityVerified email at buaa.edu.cn
- Paul RonneyProfessor and Chair of Aerospace and Mechanical Engineering, University of Southern CaliforniaVerified email at usc.edu
- Jinglin LiuDalian Maritime UniversityVerified email at dlmu.edu.cn
- Sun Ho ParkKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- Chun Sang YooProfessor of Mechanical Engineering, Ulsan National Institute of Science and TechnologyVerified email at unist.ac.kr
- Jin ParkKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- Hyunwoo ParkSamsung ElectronicsVerified email at samsung.com
- Dmitry LevkoSenior Member of Technical StaffVerified email at esgeetech.com
- Ashish SharmaComputational Plasma Scientist at Lam ResearchVerified email at utexas.edu