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- Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Xiao Yan (颜笑)Chongqing UniversityVerified email at cqu.edu.cn
- Daejoong KimSogang UniversityVerified email at sogang.ac.kr
- Soumyadip SettAssistant Professor, Indian Institute of Technology GandhinagarVerified email at iitgn.ac.in
- Kazi Fazle RabbiUniversity of illinois at Urbana-ChampaignVerified email at illinois.edu
- Kilsung KwonKorea Atomic Energy Research InstituteVerified email at kaeri.re.kr
- Muhammad Jahidul HoqueUniversity of Illinois Urbana ChampaignVerified email at illinois.edu
- Hyeongyun ChaUniversity at Buffalo, The State University of New YorkVerified email at buffalo.edu
- Junho OhDepartment of Mechanical Engineering, Hanyang University ERICAVerified email at hanyang.ac.kr
- Seungjun LeeUniversity of Illinois Urbana ChampaignVerified email at illinois.edu
- Jingcheng MaAssistant Professor, the University of Notre DameVerified email at nd.edu
- Siavash KhodakaramiBrown UniversityVerified email at brown.edu
- Chongyan ZhaoTsinghua UniversityVerified email at mails.tsinghua.edu.cn
- Kalyan BoyinaTrane TechnologiesVerified email at illinois.edu
- Thomas FoulkesFounder of Pacergy and Innovation Crossroads Entrepreneurial Fellow at Oak Ridge National LabVerified email at pacergy.com
- Peter SokalskiUniversity of Texas at AustinVerified email at utexas.edu
- Jie FengAssistant Professor, Mechanical Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Sanjiv SinhaAsst. Professor of Mechanical Engineering, University of IllinoisVerified email at illinois.edu
- Chenhui ShaoAssociate Professor, Mechanical Engineering, University of Michigan, Ann ArborVerified email at umich.edu
- Manjunath C RajagopalIntel Corporation, University of Illinois at Urbana-Champaign.Verified email at intel.com