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Nenad MiljkovicUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu- Xiao Yan (颜笑)Chongqing UniversityVerified email at cqu.edu.cn
- Jingcheng MaAssistant Professor, the University of Notre DameVerified email at nd.edu
- Longnan LiChangchun Institute of Optics Fine Mechanics and Physics, Chinese Academy of Sciences; UIUCVerified email at ciomp.ac.cn
- Muhammad Jahidul HoqueUniversity of Illinois Urbana ChampaignVerified email at illinois.edu
- Siavash KhodakaramiBrown UniversityVerified email at brown.edu
- Jin Yao HoAssistant Professor, Nanyang Technological University, SingaporeVerified email at ntu.edu.sg
- Kalyan BoyinaTrane TechnologiesVerified email at illinois.edu
- Nithin Vinod Upot, PhDSenior IC Packaging Engineer, Intel CorporationVerified email at intel.com
- Jiaqi Li (李佳琦)School of Energy and Power Engineering, Nanjing University of Science and TechnologyVerified email at njust.edu.cn
- Teck Neng WongNanyang Technological UniversityVerified email at ntu.edu.sg
- Allison MahviUniversity of Wisconsin - MadisonVerified email at wisc.edu
- Thomas FoulkesFounder of Pacergy and Innovation Crossroads Entrepreneurial Fellow at Oak Ridge National LabVerified email at pacergy.com
- Khaled Mosharraf MukutResearch Assistant, Marquette UniversityVerified email at marquette.edu
- Peter SokalskiUniversity of Texas at AustinVerified email at utexas.edu
- Sheikh Mohammad ShavikBangladesh University of Engineering and TechnologyVerified email at me.buet.ac.bd
- A. JacobiProfessor of Mechanical Engineering, University of IllinoisVerified email at illinois.edu
- Wuchen FuUniversity of Illinois Urbana-ChampaignVerified email at illinois.edu
- Jie FengAssistant Professor, Mechanical Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
- Feng ChenSchool of Physics, State Key Laboratory of Crystal Materials, Shandong UniversityVerified email at sdu.edu.cn
