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Yan ZhouThe Chinese University of Hong Kong (shenzhen)Verified email at cuhk.edu.cn
Motohiko EzawaUniversity of TokyoVerified email at ap.t.u-tokyo.ac.jp
Jing XiaShinshu UniversityVerified email at shinshu-u.ac.jp
Xiaoxi LiuProfessor, Faculty of Engineering, Shinshu UniversityVerified email at cs.shinshu-u.ac.jp
Weisheng ZhaoFert Beijing Institute, Beihang UniversityVerified email at buaa.edu.cn
Wang KangBeihang UniversityVerified email at buaa.edu.cn
Oleg A. TretiakovUniversity of New South WalesVerified email at unsw.edu.au
Laichuan ShenBeijing Normal UniversityVerified email at mail.bnu.edu.cn
Seonghoon WooAmogy, IBM, KIST, MITVerified email at amogy.co
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Na Lei北航集成电路科学与工程学院Verified email at buaa.edu.cn
Raabe JoergGroup Leader, Paul Scherrer InstitutVerified email at psi.ch
Simone FinizioPaul Scherrer InstitutVerified email at psi.ch
Daoqian Zhu (朱道乾)Beihang University, ChinaVerified email at buaa.edu.cn
Tae-Eon Park한국과학기술연구원Verified email at kist.re.kr
Guoqiang YuInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
Axel HoffmannProfessor of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
Sai LiBeihang universityVerified email at buaa.edu.cn