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Ying-Jun Angela ZhangThe Chinese University of Hong Kong; Fellow of IEEEVerified email at ie.cuhk.edu.hk
Li PingCity University of Hong KongVerified email at cityu.edu.hk
Hang LiuCornell UniversityVerified email at cornell.edu
Wenjing YanThe Hong Kong University of Science and Technology (HKUST)Verified email at connect.ust.hk
Xin WangFIEEE, Professor, Fudan UniversityVerified email at fudan.edu.cn
Zhen-Qing HeSichuan UniversityVerified email at scu.edu.cn
Soung Chang LiewThe Chinese University of Hong KongVerified email at ie.cuhk.edu.hk
Rui Wang (王睿)Tongji UniversityVerified email at tongji.edu.cn
Junjie MaICMSEC, AMSS, Chinese Academy of SciencesVerified email at lsec.cc.ac.cn
Marco Di RenzoCNRS Research Director - CentraleSupelec, Paris-Saclay UniversityVerified email at l2s.centralesupelec.fr
Qinghua GuoThe University of WollongongVerified email at uow.edu.au
Huiyuan YangUniversity of Electronic Science and Technology of ChinaVerified email at std.uestc.edu.cn
Meixia TaoProfessor at Shanghai Jiao Tong University; Fellow of IEEEVerified email at sjtu.edu.cn
Jun FangUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
Zhaoxi FangShaoxing UniversityVerified email at msu.edu
Iain CollingsMacquarie UniversityVerified email at mq.edu.au
Zhipeng XuePost graduate at ShanghaiTech UniversityVerified email at shanghaitech.edu.cn
Tian DingShenzhen Research Institute of Big DataVerified email at sribd.cn
Fanggang WangSchool of Electronic and Information Engineering, Beijing Jiaotong UniversityVerified email at bjtu.edu.cn
Lei ChenIntel CorporationVerified email at intel.com