| almaBTE: A solver of the space–time dependent Boltzmann transport equation for phonons in structured materials J Carrete, B Vermeersch, A Katre, A van Roekeghem, T Wang, ... Computer Physics Communications 220, 351-362, 2017 | 298 | 2017 |
| Temperature and Thickness Dependences of the Anisotropic In‐Plane Thermal Conductivity of Black Phosphorus B Smith, B Vermeersch, J Carrete, E Ou, J Kim, N Mingo, D Akinwande, ... Advanced Materials 29 (5), 1603756, 2017 | 140 | 2017 |
| Superdiffusive heat conduction in semiconductor alloys. I. Theoretical foundations B Vermeersch, J Carrete, N Mingo, A Shakouri Physical Review B 91 (8), 085202, 2015 | 136 | 2015 |
| Superdiffusive heat conduction in semiconductor alloys. II. Truncated Lévy formalism for experimental analysis B Vermeersch, AMS Mohammed, G Pernot, YR Koh, A Shakouri Physical Review B 91 (8), 085203, 2015 | 109 | 2015 |
| Full-field thermal imaging of quasiballistic crosstalk reduction in nanoscale devices A Ziabari, P Torres, B Vermeersch, Y Xuan, X Cartoixà, A Torelló, JH Bahk, ... Nature Communications 9 (1), 255, 2018 | 97 | 2018 |
| Cross-plane heat conduction in thin films with ab-initio phonon dispersions and scattering rates B Vermeersch, J Carrete, N Mingo Applied Physics Letters 108 (19), 193104, 2016 | 62 | 2016 |
| A fixed-angle heat spreading model for dynamic thermal characterization of rear-cooled substrates B Vermeersch, G De Mey Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management …, 2007 | 61 | 2007 |
| Influence of substrate thickness on thermal impedance of microelectronic structures B Vermeersch, G De Mey Microelectronics reliability 47 (2-3), 437-443, 2007 | 54 | 2007 |
| Direct observation of nanoscale Peltier and Joule Effects at metal–insulator domain walls in vanadium dioxide nanobeams T Favaloro, J Suh, B Vermeersch, K Liu, Y Gu, LQ Chen, KX Wang, J Wu, ... Nano letters 14 (5), 2394-2400, 2014 | 51 | 2014 |
| Thermal impedance plots of micro-scaled devices B Vermeersch, G De Mey Microelectronics Reliability 46 (1), 174-177, 2006 | 44 | 2006 |
| Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers B Vermeersch, JH Bahk, J Christofferson, A Shakouri Journal of Applied Physics 113 (10), 104502, 2013 | 42 | 2013 |
| Time and frequency domain CCD-based thermoreflectance techniques for high-resolution transient thermal imaging B Vermeersch, J Christofferson, K Maize, A Shakouri, G De Mey 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 39 | 2010 |
| Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance P Kawka, G De Mey, B Vermeersch IEEE Transactions on Components and Packaging Technologies 30 (4), 660-665, 2007 | 38 | 2007 |
| Fractal Lévy Heat Transport in Nanoparticle Embedded Semiconductor Alloys AMS Mohammed, YR Koh, B Vermeersch, H Lu, PG Burke, AC Gossard, ... Nano letters 15 (7), 4269-4273, 2015 | 37 | 2015 |
| Quasi-ballistic thermal transport in Al0.1Ga0.9N thin film semiconductors YR Koh, MA Shirazi-HD, B Vermeersch, AMS Mohammed, J Shao, ... Applied Physics Letters 109 (24), 243107, 2016 | 35 | 2016 |
| Thermal interfacial transport in the presence of ballistic heat modes B Vermeersch, AMS Mohammed, G Pernot, YR Koh, A Shakouri Physical Review B 90 (1), 014306, 2014 | 34 | 2014 |
| Non-Fourier thermal conduction in nano-scaled electronic structures B Vermeersch, G De Mey Analog Integrated Circuits and Signal Processing 55 (3), 197-204, 2008 | 34 | 2008 |
| Non-Fourier thermal conduction in nano-scaled electronic structures B Vermeersch, G De Mey Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006 …, 2006 | 34 | 2006 |
| Dependency of thermal spreading resistance on convective heat transfer coefficient B Vermeersch, G De Mey Microelectronics Reliability 48 (5), 734-738, 2008 | 32 | 2008 |
| Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses M Janicki, J Banaszczyk, B Vermeersch, G De Mey, A Napieralski Microelectronics Reliability 51 (8), 1351-1355, 2011 | 31 | 2011 |
