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Co-authors
- Takashi AndoIBM T. J. Watson Research CenterVerified email at us.ibm.com
- Eduard A CartierIBM Research, T. J. Watson Research CenterVerified email at us.ibm.com
- Martin M. FrankIBM ResearchVerified email at us.ibm.com
- Barry P. LinderResearch Staff Member, IBMVerified email at us.ibm.com
- John BruleyIBMVerified email at us.ibm.com
- Matt CopelIBM TJ Watson Research CenterVerified email at us.ibm.com
- Vamsi ParuchuriASM, IBM Research, University of UtahVerified email at asm.com
- Supratik GuhaUniversity of Chicago and Argonne National LaboratoryVerified email at uchicago.edu
- Sufi ZafarIBM TJ Watson Research Center, Yorktown Heights, NYVerified email at us.ibm.com
- Evgeni GusevQualcommVerified email at qti.qualcomm.com
- Prof. Subhash MahajanUniversity of California DavisVerified email at ucdavis.edu
- Michael ChudzikIBM, Applied Materials, ArgonnneVerified email at amat.com
- Changhwan ChoiHanyang University, Materials Science and EngineeringVerified email at hanyang.ac.kr
- Kisik ChoiIBMVerified email at ibm.com
- Dae-gyu ParkSenior Manager, IBM T.J.Watson Research CenterVerified email at us.ibm.com
- Christian LavoieManager Advanced Characterization, IBM T.J. Watson Research Center, Yorktown Heights, NYVerified email at us.ibm.com
- Richard HaightIBM T.J. Watson Research CenterVerified email at us.ibm.com
- Lisa EdgeHRL LaboratoriesVerified email at hrl.com
- Gert LeusinkVerified email at us.tel.com
- Catherine DubourdieuHelmholtz Zentrum BerlinVerified email at helmholtz-berlin.de