| Power conversion with SiC devices at extremely high ambient temperatures T Funaki, JC Balda, J Junghans, AS Kashyap, HA Mantooth, F Barlow, ... IEEE Transactions on Power electronics 22 (4), 1321-1329, 2007 | 402 | 2007 |
| Thin film technology handbook A Elshabini-Riad, FD Barlow III (No Title), 1998 | 347 | 1998 |
| Extending the ZVS operating range of dual active bridge high-power DC-DC converters GG Oggier, R Leidhold, GO Garcia, AR Oliva, JC Balda, F Barlow 2006 37th IEEE power electronics specialists conference, 1-7, 2006 | 194 | 2006 |
| Development of a SiC JFET-based six-pack power module for a fully integrated inverter F Xu, TJ Han, D Jiang, LM Tolbert, F Wang, J Nagashima, SJ Kim, ... IEEE Transactions on Power Electronics 28 (3), 1464-1478, 2012 | 160 | 2012 |
| An overview to integrated power module design for high power electronics packaging AB Lostetter, F Barlow, A Elshabini Microelectronics reliability 40 (3), 365-379, 2000 | 111 | 2000 |
| Ceramic interconnect technology handbook FD Barlow III, A Elshabini CRC Press, 2018 | 90 | 2018 |
| Fabrication of microvias for multilayer LTCC substrates G Wang, EC Folk, F Barlow, A Elshabini IEEE transactions on electronics packaging manufacturing 29 (1), 32-41, 2006 | 80 | 2006 |
| Microfluidic device utilizing magnetohydrodynamics and method for fabrication thereof ESO Fakunle, PU Arumugam, I Fritsch, JE Mincy, FD Barlow III, G Wang US Patent 7,467,928, 2008 | 58 | 2008 |
| 18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules H Zhang, LM Tolbert, JH Han, MS Chinthavali, F Barlow 2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010 | 56 | 2010 |
| Characterization of SiC JFET for temperature dependent device modeling T Funaki, AS Kashyap, HA Mantooth, JC Balda, FD Barlow, T Kimoto, ... 2006 37th IEEE Power Electronics Specialists Conference, 1-6, 2006 | 43 | 2006 |
| Fabrication of precise fluidic structures in LTCC F Barlow, J Wood, A Elshabini, EF Stephens, R Feeler, G Kemner, ... International Journal of Applied Ceramic Technology 6 (1), 18-23, 2009 | 41 | 2009 |
| Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging DPH Hasselman, KY Donaldson, FD Barlow, AA Elshabini, GH Schiroky, ... IEEE Transactions on Components and Packaging Technologies 23 (4), 633-637, 2000 | 41 | 2000 |
| SiC JFET dc characteristics under extremely high ambient temperatures T Funaki, JC Balda, J Junghans, AS Kashyap, FD Barlow, HA Mantooth, ... IEICE Electronics Express 1 (17), 523-527, 2004 | 38 | 2004 |
| Low cost flex substrates for miniaturized electronic assemblies F Barlow, A Lostetter, A Elshabini Microelectronics reliability 42 (7), 1091-1099, 2002 | 37 | 2002 |
| High-temperature high-power packaging techniques for HEV traction applications FD Barlow, A Elshabini Oak Ridge National Lab.(ORNL), Oak Ridge, TN (United States), 2006 | 33 | 2006 |
| High density 50 kW SiC inverter systems using a JFET based six-pack power module TJ Han, J Nagashima, SJ Kim, S Kulkarni, F Barlow 8th International Conference on Power Electronics-ECCE Asia, 764-769, 2011 | 32 | 2011 |
| Getting aggressive with passive devices RK Ulrich, WD Brown, SS Ang, FD Barlow, A Elshabini, TG Lenihan, ... IEEE Circuits and Devices Magazine 16 (5), 16-25, 2000 | 32 | 2000 |
| High power SiC modules for HEVs and PHEVs M Chinthavali, LM Tolbert, H Zhang, JH Han, F Barlow, B Ozpineci The 2010 International Power Electronics Conference-ECCE ASIA-, 1842-1848, 2010 | 31 | 2010 |
| An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications G Wang, M Van, F Barlow, A Elshabini IEEE Microwave and wireless components letters 15 (5), 357-359, 2005 | 29 | 2005 |
| Switching characteristics of SiC JFET and Schottky diode in high-temperature dc-dc power converters T Funaki, JC Balda, J Junghans, A Jangwanitlert, S Mounce, FD Barlow, ... IEICE Electronics Express 2 (3), 97-102, 2005 | 28 | 2005 |
