| Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering D Lorenzini, C Green, TE Sarvey, X Zhang, Y Hu, AG Fedorov, MS Bakir, ... International Journal of Heat and Mass Transfer 103, 1359-1370, 2016 | 106 | 2016 |
| A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration C Green, P Kottke, X Han, C Woodrum, T Sarvey, P Asrar, X Zhang, ... Journal of Electronic Packaging 137 (4), 040802, 2015 | 78 | 2015 |
| Integrated circuit cooling using heterogeneous micropin-fin arrays for nonuniform power maps TE Sarvey, Y Hu, CE Green, PA Kottke, DC Woodrum, YK Joshi, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 47 | 2017 |
| Embedded cooling technologies for densely integrated electronic systems TE Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheung, ... 2015 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2015 | 46 | 2015 |
| Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... International Journal of Heat and Mass Transfer 108, 1702-1713, 2017 | 40 | 2017 |
| Monolithic integration of a micropin-fin heat sink in a 28-nm FPGA TE Sarvey, Y Zhang, C Cheung, R Gutala, A Rahman, A Dasu, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 34 | 2017 |
| Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems TE Sarvey, Y Zhang, Y Zhang, H Oh, MS Bakir Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 32 | 2014 |
| Hotspot thermal management with flow boiling of refrigerant in ultrasmall microgaps MH Nasr, CE Green, PA Kottke, X Zhang, TE Sarvey, YK Joshi, MS Bakir, ... Journal of Electronic Packaging 139 (1), 011006, 2017 | 27 | 2017 |
| Thermal evaluation of 2.5-D integration using bridge-chip technology: Challenges and opportunities Y Zhang, TE Sarvey, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017 | 22 | 2017 |
| Fluid routing devices and methods for cooling integrated circuit packages R Gutala, A Rahman, A Dasu, T Sarvey, D Kulkarni US Patent 10,770,372, 2020 | 21 | 2020 |
| Three-dimensional integrated circuit with embedded microfluidic cooling: Technology, thermal performance, and electrical implications X Zhang, X Han, TE Sarvey, CE Green, PA Kottke, AG Fedorov, Y Joshi, ... Journal of Electronic Packaging 138 (1), 010910, 2016 | 20 | 2016 |
| Single phase liquid cooling of hotspots in a heterogeneous pin-fin-enhanced microgap with non-uniform fin array Y Hu, T Sarvey, M Bakir, Y Joshi 2017 16th IEEE intersociety conference on thermal and thermomechanical …, 2017 | 18 | 2017 |
| Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management R Abbaspour, DC Woodrum, PA Kottke, TE Sarvey, CE Green, YK Joshi, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 17 | 2016 |
| Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3-D ICs Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 16 | 2015 |
| Flow boiling of R245fa in a microgap with integrated staggered pin fins P Asrar, X Zhang, CD Woodrum, CE Green, PA Kottke, TE Sarvey, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 15 | 2016 |
| Performance and integration implications of addressing localized hotspots through two approaches: Clustering of micro pin-fins and dedicated microgap coolers CE Green, PA Kottke, TE Sarvey, AG Fedorov, Y Joshi, MS Bakir International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 15 | 2015 |
| Dynamic thermal management for 3-D ICs with time-dependent power map using microchannel cooling and machine learning YS Li, H Yu, H Jin, TE Sarvey, H Oh, MS Bakir, M Swaminathan, EP Li IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 14 | 2019 |
| Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation Y Zhang, TE Sarvey, MS Bakir 2014 International 3D Systems Integration Conference (3DIC), 1-5, 2014 | 14 | 2014 |
| Microfluidic cooling of a 14-nm 2.5-D FPGA with 3-D printed manifolds for high-density computing: Design considerations, fabrication, and electrical characterization TE Sarvey, A Kaul, SK Rajan, A Dasu, R Gutala, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 13 | 2019 |
| Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins P Asrar, X Zhang, CE Green, PA Kottke, TE Sarvey, A Fedorov, MS Bakir, ... 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016 | 12 | 2016 |
