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Axel HoffmannProfessor of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
John PearsonArgonne National LaboratoryVerified email at anl.gov
M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
Joseph SklenarWayne State UniversityVerified email at wayne.edu
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Yi LiArgonne National LaboratoryVerified email at anl.gov
novosad, v.Argonne National LaboratoryVerified email at anl.gov
Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
John KettersonNorthwestern UniversityVerified email at northwestern.edu
Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Peng LiStanford UniversityVerified email at stanford.edu
Junjia DingHardware Engineer, Verily Life SciencesVerified email at google.com
Frank FradinArgonne National LaboratoryVerified email at anl.gov
Kannan M KrishnanUniversity of WashingtonVerified email at uw.edu
Wai-Kwong KwokArgonne National LaboratoryVerified email at anl.gov
Frank FreimuthPostdoc, Forschungszentrum JülichVerified email at fz-juelich.de
Yuriy MokrousovForschungszentrum Jülich, Johannes Gutenberg University MainzVerified email at fz-juelich.de
Mingzhong WuDepartment of Physics, Colorado State UniversityVerified email at colostate.edu
pramey upadhyayaPurdueVerified email at purdue.edu
yizheng wufudan universityVerified email at fudan.edu.cn