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- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Xufeng KouShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Yabin FanWestern Digital/MIT/UCLAVerified email at wdc.com
- Liang HeProfessor, Nanjing University, ChinaVerified email at nju.edu.cn
- Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Guoqiang YuInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
- Faxian XiuPhysics Department, Fudan UniversityVerified email at fudan.edu.cn
- lj Chen新竹清華大學材料科學工程教授Verified email at mx.nthu.edu.tw
- Qing CaoUniversity of Illinois at Urbana ChampaignVerified email at illinois.edu
- Caifu ZengUniversity of California, Los AngelesVerified email at ucla.edu
- Xu GuangyuAssociate Professor, UMass AmherstVerified email at umass.edu
- Richard KanerUniversity of California, Los AngelesVerified email at chem.ucla.edu
- Xiangfeng DuanUniversity of California, Los AngelesVerified email at chem.ucla.edu
- Chiu-Yen Wang (王秋燕)Department of Materials Science and Engineering, National Taiwan University of Science andVerified email at mail.ntust.edu.tw
- Jerry TersoffIBMVerified email at us.ibm.com
- Aaron FranklinAddy Professor of Electrical & Computer Engineering, Duke UniversityVerified email at duke.edu
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