‪Ai Ting Tan‬ - ‪Google Scholar‬

Eigenes Profil erstellen

Zitiert von

	Alle	Seit 2019
Zitate	187	137
h-index	4	4
i10-index	4	4

0

40

20

2016201720182019202020212022202320246 19 23 23 17 39 23 29 6

Ai Ting Tan

Ai Ting Tan

PhD student

Bestätigte E-Mail-Adresse bei siswa.um.edu.my

Soldering ultrasonic joining


Titel Nach Zitationen sortieren Nach Jahr sortieren Nach Titel sortieren	Zitiert von Zitiert von	Jahr
Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions AT Tan, AW Tan, F Yusof Science and technology of advanced materials 16 (3), 033505, 2015	80	2015
Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering AT Tan, AW Tan, F Yusof Ultrasonics sonochemistry 34, 616-625, 2017	48	2017
Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power AT Tan, AW Tan, F Yusof Journal of Alloys and Compounds 705, 188-197, 2017	43	2017
Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints AT Tan, AW Tan, F Yusof Journal of Materials Processing Technology 238, 8-14, 2016	16	2016
Ultrasonic assisted reflow soldering of lead free solder joint/Tan Ai Ting AT Tan University of Malaya, 2017		2017

Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.

Artikel 1–5