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Co-authors
Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Alexey ChernikovDresden University of Technology (TU Dresden), University of RegensburgVerified email at tu-dresden.de
- Heather M. HillBureau of Engraving and Printing, Department of TreasuryVerified email at bep.gov
- Albert RigosiNational Institute of Standards and TechnologyVerified email at nist.gov
- Annie Xian ZhangMechanical Engineering, Stevens Institute of TechnologyVerified email at stevens.edu
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Daniel A. ChenetColumbia UniversityVerified email at columbia.edu
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- Yufeng Hao (郝玉峰)Professor of Materials Science and Engineering, Nanjing UniversityVerified email at nju.edu.cn
- Mark S HybertsenSenior Physicist, Emeritus, Center for Functional Nanomaterials, Brookhaven National LaboratoryVerified email at bnl.gov
- Lei WangColumbia UniversityVerified email at columbia.edu
- Damon B. FarmerIBM T.J. Watson Research CenterVerified email at us.ibm.com
- Phaedon AvourisIBM Fellow, Emeritus and University of Minnesota, MinneapolisVerified email at umn.edu
- En-Min ShihColumbia UniversityVerified email at columbia.edu
- David ReisStanford PULSE Institute, Department of Applied Physics, Department of Photon ScienceVerified email at stanford.edu
- Hanzhe LiuPurdue UniversityVerified email at purdue.edu
- Yong Sing YouStanford UniversityVerified email at slac.stanford.edu
- Shambhu GhimireSLAC National Accelerator Lab & Stanford UniversityVerified email at slac.stanford.edu
- Cory R. DeanColumbia UnviersityVerified email at phys.columbia.edu
