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- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Cory R. DeanColumbia UnviersityVerified email at phys.columbia.edu
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- Kenneth ShepardLau Family Professor of Electrical Engineering and Professor of Biomedical Engineering, ColumbiaVerified email at ee.columbia.edu
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Haoxin ZhouUniversity of California, BerkeleyVerified email at berkeley.edu
- Lei WangColumbia UniversityVerified email at columbia.edu
- Inanc MericIntel Co.Verified email at intel.com
- Hryhoriy PolshynInstitute of Science and Technology AustriaVerified email at ist.ac.at
- Michael P ZaletelUniversity of California, BerkeleyVerified email at berkeley.edu
- Raymond AshooriMIT, Department of PhysicsVerified email at mit.edu
- Pablo Jarillo-HerreroProfessor of Physics, MITVerified email at mit.edu
- Benjamin M. HuntCarnegie MellonVerified email at andrew.cmu.edu
- Charles Lincoln TschirhartKIC postdoctoral scholar, Cornell UniversityVerified email at cornell.edu
- Yuxuan ZhangUMDVerified email at umd.edu
- Sebastian SorgenfreiEngineer, Apple Inc.Verified email at apple.com
- Matthew YankowitzUniversity of WashingtonVerified email at uw.edu
- Changgu LeeSungkyunkwan UniversityVerified email at skku.edu
- Alexander A. ZibrovPost Doctoral Researcher, Harvard UniversityVerified email at fas.harvard.edu