| A study on the sensitivity of Drucker–Prager Cap model parameters during the decompression phase of powder compaction simulations T Sinha, JS Curtis, BC Hancock, C Wassgren Powder Technology 198 (3), 315-324, 2010 | 75 | 2010 |
| Finite element analysis of pharmaceutical tablet compaction using a density dependent material plasticity model T Sinha, R Bharadwaj, JS Curtis, BC Hancock, C Wassgren Powder Technology 202 (1-3), 46-54, 2010 | 74 | 2010 |
| Polygon die packaging TJ Davis, T Sinha US Patent 9,911,716, 2018 | 19 | 2018 |
| A systematic exploration of the failure mechanisms in underfilled flip-chip packages T Sinha, TJ Davis, TE Lombardi, JT Coffin 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1509-1517, 2015 | 16 | 2015 |
| Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packages T Sinha, JA Zitz, RN Wagner, S Iruvanti Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 11 | 2014 |
| Multi integrated circuit chip carrier package ME Interrante, KR Lange, KK Sikka, T Sinha, HT Toy, JA Zitz US Patent 10,541,156, 2020 | 10 | 2020 |
| Measurements of interfacial strengths in underfilled flip-chip electronic packages using Wedge Delamination Method (WDM) T Sinha, KK Sikka, DN Yannitty, PF Bodenweber Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 9 | 2014 |
| Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages S Swaminathan, KK Sikka, RF Indyk, T Sinha Microelectronics Reliability 66, 161-172, 2016 | 8 | 2016 |
| Geometric optimization and mechanical risk mmitigation in 2.5 D flip-chip packages using parametric finite element analysis (FEA) simulations T Sinha, S Li, K Tunga, JA Zitz, KK Sikka 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 8 | 2016 |
| Artificial neural networks and bayesian techniques for flip-chip package thermo-mechanical analysis T Sinha, K Sikka, R Lall 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1442-1449, 2021 | 7 | 2021 |
| Method and structure for flip-chip package reliability monitoring using capacitive sensors groups TJ Davis, JR Fry, T Sinha US Patent 10,553,503, 2020 | 7 | 2020 |
| Effect of Underfill Formulation on Large-Die, Flip-Chip Organic Package Reliability: A Systematic Study on Compositional and Assembly Process Variations MC Pacquet, C Dufort, TL Lombardi, T Sinha, M Hasegawa, K Okoshi, K Kohara Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, 2016 | 7* | 2016 |
| Plasma Anti-Glial Fibrillary Acidic Protein (GFAP) Autoantibody Levels During the Acute and Chronic Phases of Traumatic Brain Injury-A TRACK-TBI Pilot Study KK Wang, Z Yang, JK Yue, Z Zhang, EA Winkler, A Puccio, ... Journal of neurotrauma, 2015 | 6 | 2015 |
| Artificial neural networks for package thermal analysis K Sikka, R Lall, T Sinha 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 4 | 2021 |
| Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring TJ Davis, JR Fry, T Sinha US Patent 10,008,427, 2018 | 4 | 2018 |
| Method and structure for flip-chip package reliability monitoring using capacitive sensors groups TJ Davis, JR Fry, T Sinha US Patent 9,818,655, 2017 | 4 | 2017 |
| Review of percolating and neck-based underfills with thermal conductivities of up-to 3 W/m-K T Brunschwiler, J Zuercher, S Zimmermann, B Burg, G Schlottig, X Chen, T ... Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 …, 2016 | 4* | 2016 |
| Back-end-of-Line (BEOL) Mechanical Integrity Evaluation: A Mixed-Mode Double Cantilever Beam Test for Crackstop Strength Assessment M Cioban, T Sinha, TM Shaw 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 467-475, 2018 | 3 | 2018 |
| Finite element analysis of lidded flip-chip packages: A study on the impact of thermal interface material compressibility and stress-free conditions on modeling predictions T Sinha International Symposium on Microelectronics 2015 (1), 000151-000156, 2015 | 3 | 2015 |
| Modeling and experimental study of thin bond line thermal interface material failure S Li, T Sinha, TJ Davis, K Sikka, P Bodenweber 2013 IEEE 63rd Electronic Components and Technology Conference, 803-806, 2013 | 3 | 2013 |
Shidong LiIBM, University at Buffalo, Tongji UniversityVerified email at us.ibm.com
