Nadiia Kulyk
Nadiia Kulyk
Helmholtz Institute Erlangen-Nürnberg for Renewable Energy (IEK-11), Forschungszentrum Jülich
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Oxygen and hydrogen evolution reactions on Ru, RuO2, Ir, and IrO2 thin film electrodes in acidic and alkaline electrolytes: A comparative study on activity and stability
S Cherevko, S Geiger, O Kasian, N Kulyk, JP Grote, A Savan, ...
Catalysis Today 262, 170-180, 2016
Dissolution of noble metals during oxygen evolution in acidic media
S Cherevko, AR Zeradjanin, AA Topalov, N Kulyk, I Katsounaros, ...
ChemCatChem 6 (8), 2219-2223, 2014
Durability of platinum-based fuel cell electrocatalysts: Dissolution of bulk and nanoscale platinum
S Cherevko, N Kulyk, KJJ Mayrhofer
Nano energy 29, 275-298, 2016
Dissolution of platinum in the operational range of fuel cells
S Cherevko, GP Keeley, S Geiger, AR Zeradjanin, N Hodnik, N Kulyk, ...
ChemElectroChem 2 (10), 1471-1478, 2015
Platinum dissolution in realistic fuel cell catalyst layers
K Ehelebe, J Knöppel, M Bierling, B Mayerhöfer, T Böhm, N Kulyk, ...
Angewandte Chemie 133 (16), 8964-8970, 2021
Hydrogen sensing performance of electrodeposited conoidal palladium nanowire and nanotube arrays
S Cherevko, N Kulyk, J Fu, CH Chung
Sensors and Actuators B: Chemical 136 (2), 388-391, 2009
Nanoporous Pt@AuxCu100–x by Hydrogen Evolution Assisted Electrodeposition of AuxCu100–x and Galvanic Replacement of Cu with Pt: Electrocatalytic …
S Cherevko, N Kulyk, CH Chung
Langmuir 28 (6), 3306-3315, 2012
Nanoporous palladium with sub-10 nm dendrites by electrodeposition for ethanol and ethylene glycol oxidation
S Cherevko, N Kulyk, CH Chung
Nanoscale 4 (1), 103-105, 2012
Insights into liquid product formation during carbon dioxide reduction on copper and oxide-derived copper from quantitative real-time measurements
M Löffler, P Khanipour, N Kulyk, KJJ Mayrhofer, I Katsounaros
ACS catalysis 10 (12), 6735-6740, 2020
Electrochemical dissolution of gold in presence of chloride and bromide traces studied by on-line electrochemical inductively coupled plasma mass spectrometry
O Kasian, N Kulyk, A Mingers, AR Zeradjanin, KJJ Mayrhofer, S Cherevko
Electrochimica acta 222, 1056-1063, 2016
Pulse-reverse electrodeposition for mesoporous metal films: combination of hydrogen evolution assisted deposition and electrochemical dealloying
S Cherevko, N Kulyk, CH Chung
Nanoscale 4 (2), 568-575, 2012
Utilization of surface active sites on gold in preparation of highly reactive interfaces for alcohols electrooxidation in alkaline media
S Cherevko, N Kulyk, CH Chung
Electrochimica acta 69, 190-196, 2012
Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
N Kulyk, S Cherevko, CH Chung
Electrochimica Acta 59, 179-185, 2012
Pt sub-monolayer on Au: system stability and insights into platinum electrochemical dissolution
S Cherevko, GP Keeley, N Kulyk, KJJ Mayrhofer
Journal of The Electrochemical Society 163 (3), H228, 2016
Numerical simulation of an electrochemical flow cell with V-shape channel geometry
N Kulyk, S Cherevko, M Auinger, C Laska, KJJ Mayrhofer
Journal of The Electrochemical Society 162 (12), H860, 2015
Electrodeposition mechanism of palladium nanotube and nanowire arrays
S Cherevko, J Fu, N Kulyk, SM Cho, S Haam, CH Chung
Journal of nanoscience and nanotechnology 9 (5), 3154-3159, 2009
Technological pathways to produce compressed and highly pure hydrogen from solar power
ME Ivanova, R Peters, M Müller, S Haas, MF Seidler, G Mutschke, ...
Angewandte Chemie International Edition 62 (32), e202218850, 2023
On the time resolution of electrochemical scanning flow cell coupled to downstream analysis
V Shkirskiy, FD Speck, N Kulyk, S Cherevko
Journal of The Electrochemical Society 166 (16), H866, 2019
Catalytic flow with a coupled finite difference—Lattice Boltzmann scheme
N Kulyk, D Berger, AS Smith, J Harting
Computer physics communications 256, 107443, 2020
Study on electrochemical mechanical polishing process of copper circuit on PCB
N Kulyk, CY An, JH Oh, SM Cho, C Ryu, YK Ko, CH Chung
Korean journal of chemical engineering 27, 310-314, 2010
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