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- Roman Engel-HerbertDirektor, Paul-Drude-Institut für Festkörperelektronik, Leibniz Institut im Foschungsverbund BerlinVerified email at pdi-berlin.de
- Haicheng XuanCollege of Materials Science and Engineering, Taiyuan University of TechnologyVerified email at tyut.edu.cn
- Sungwook HongAssistant Professor of Engineering, California State University, BakersfieldVerified email at csub.edu
- Adri van DuinDistinguished Professor of Mechanical Engineering, Penn State UniversityVerified email at psu.edu
- Md Mahbubul IslamAssistant Professor of Mechanical Engineering, Wayne State UniversityVerified email at wayne.edu
- Sudhir KylasaPurdue UniversityVerified email at purdue.edu
- Venkatraman GopalanPennsylvania State UniversityVerified email at psu.edu
- Craig EatonPenn State UniversityVerified email at psu.edu
- Matthew BrahlekStaff Scientist, Oak Ridge National LaboratoryVerified email at ornl.gov
- Yuanjun ZhouColumbia UniversityVerified email at bloomberg.net
- Karin M. RabeProfessor of Physics, Rutgers UniversityVerified email at physics.rutgers.edu
- Nasim AlemPennsylvania State UniversityVerified email at psu.edu
- Ryan HaislmaierPsiQuantumVerified email at psiquantum.com
- Debangshu MukherjeeR&D Associate, Oak Ridge National LaboratoryVerified email at ornl.gov
- Ashish AgrawalDevcie Engineer at Components Research, Intel CorporationVerified email at intel.com
- Eugene FreemanHoneywell AerospaceVerified email at honeywell.com
- John BaddingProfessor of Chemistry, Physics, Materials Science and Engineering, Penn State UniversityVerified email at chem.psu.edu
- Hanjong PaikAssistant Professor, School of Electrical & Computer Engineering (ECE), University of Oklahoma (OU)Verified email at ou.edu
- Darrell G. SchlomCornell UniversityVerified email at cornell.edu
- Arun V. ThathacharyPhD., Device Engineer, Intel Corp.Verified email at intel.com