Get my own profile
Public access
View all5 articles
0 articles
available
not available
Based on funding mandates
Co-authors
Eric PopPease-Ye Professor of Electrical Engineering, MSE, AP at Stanford & SLACVerified email at stanford.edu
Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
David EstradaBoise State University; Idaho National LaboratoryVerified email at boisestate.edu
Tomás PalaciosMITVerified email at mit.edu
Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.krVerified email at kriss.re.kr
Prof. Jing KongMassachusetts Institute of TechnologyVerified email at mit.edu
Enrique CarrionIntelVerified email at intel.com
Daniele IelminiProfessor of ElectronicsVerified email at elet.polimi.it
Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
K. Jimmy HsiaProfessor of Mechanical Engineering and Biomedical Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
Debdeep JenaCornell UniversityVerified email at cornell.edu
Hongjie DaiProfessor of chemistry, stanford universityVerified email at stanford.edu
Xinran WangProfessor, Nanjing UniversityVerified email at nju.edu.cn
William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University ofVerified email at illinois.edu
Paulo T AraujoDepartment of Physics and Astrophysics - University of AlabamaVerified email at ua.edu
Moonsub ShimProfessor of Materials Science & Engineering, University of IllinoisVerified email at illinois.edu
Jungchul LeeMechanical Engineering, Korea Advanced Institute of Science and TechnologyVerified email at kaist.ac.kr
Runjie (Lily) XuStanford UniversityVerified email at apple.com
Zuanyi LiASMLVerified email at illinois.edu